EPM900 Bond Out Chips

Hi,
I bought an EPM900 to help me work with the LPC915. It came with three bond-out parts:- LPC9351, 936 and 938. I can't find any docs describing their application in the EPM900.
I realise I can probably just look at the data sheets for functionality but what is the difference with the bond-out parts and which subset of parts does each apply to for emulation?

Thanks

RG