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EPM900 Bond Out Chips

Rab Gillatt

Hi,
I bought an EPM900 to help me work with the LPC915. It came with three bond-out parts:- LPC9351, 936 and 938. I can't find any docs describing their application in the EPM900.
I realise I can probably just look at the data sheets for functionality but what is the difference with the bond-out parts and which subset of parts does each apply to for emulation?

Thanks

RG

Parents
  • 0 in reply to Rab Gillatt

    I had a similar problem recently. The information I eventually found was that provided that the bondout chip contained the peripherals of the target device it will work. The early EPM900s only came with a LPC932 bondout chip so I couldn't simulate a LPC935 because the bondout chip did not have an A/D. I could still use it provided I did not need the A/D.

Reply
  • 0 in reply to Rab Gillatt

    I had a similar problem recently. The information I eventually found was that provided that the bondout chip contained the peripherals of the target device it will work. The early EPM900s only came with a LPC932 bondout chip so I couldn't simulate a LPC935 because the bondout chip did not have an A/D. I could still use it provided I did not need the A/D.

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