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Arm at MWC Shanghai - Day Two Highlights

Carl Williamson
Carl Williamson
June 30, 2017
1 minute read time.

Irene Yu provides an update to news and activity highlights for Arm at Mobile World Conference Shanghai 2017 from Thursday, June 29th. 

IoT & 5G have become the primary highlights of MWC Shanghai 2017. Keynote speakers have touched upon 4 major topics: IoT, 5G, AI and Cloud Services; their talks have described their respective perception of IoT & 5G in terms of how it will enable opportunities and possibilities, not only for the industry, but also the people, echoing the theme of this year’s MWC Shanghai: The Human Element.

MWC Shanghai 2017 keynote messages

Steve Mollenkopf, CEO of Qualcomm, delivered a keynote “Innovations Toward 5G”, highlighted what Qualcomm believes are the key trends and important foundations for 5G, including; LTE technology as the instrumental foundation for 5G, expanding LTE to address the connectivity needs of IoT, making 5G real and speeding up technical innovation on devices.

Li Changzhu, VP (Strategy and New Business), Smartphone Product Line, Huawei, described Huawei’s R&D roadmap for the “Smart+” era. Huawei will leverage and integrate 4G/5G, AI, Big Data and advanced sensors and algorithms to create a Huawei IoT Ecosystem; Li also introduced the five core strength of Huawei: users, home networking, HiLink protocol, LiteOS and IoT chips.

China Unicom President Lu Yimin stated in his keynote that operators, broadly perceived as the key architect of the mobile internet era, have already set sail for the IoT era. He said that in a “Everything Connected” world, operators need to become “Smart Operators” and provide better service to users across network, Cloud, IoT and Big Data services.

Arm Highlights

  • Through a Q&A session, Ian Smythe and Michael Horne explained the latest development status of Arm’s CPU and IoT business units as well as DesignStart Program and mbed solutions.

Partner Highlights:

  • Qualcomm launched Snapdragon 450 mobile platform. It is the first solution in the Snapdragon 400 family that adopts 14nm FinFET process technology. It is expected that Snapdragon 450 chips will start shipment in Q3 2017 while  consumer devices powered by Snapdragon 450 will start shipping by end of this year.
  • China Unicom, Ericsson and Qualcomm together completed world’s first VoLTE over EMTC (CAT-M1) IoT use cases. At MWC Shanghai 2017 the three companies demonstrated two application cases of CAT-M1 VoLTE: a fire alarm touch panel and a GPS emergency tracing device.
  • Meizu launched its new entry-level smart phone M5A at RMB699.

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