hi,
i decided to have a look at SIMD intrinsics instructions but there is a lt of documentation but i cannot find exemple.
So i decide once again to ask question about how to use SIMD with exemple.
i need only 2 exemple. Than i think a should be able to mixte practique et knowledge.
the first axemple is how to do when (*in1) are INT array . the traitment is inside this append in loop (*in1)[x] - (*in1)[y], the intrincis should be VSUB if i read correctky and VABS. But i need the syntaxe code.
ONE:
int diff1 = std::abs((*in1)[x].raw_col_min - (*in1)[y].raw_col_min); int diff2 = std::abs((*in1)[x].min - (*in1)[y].min); int diff3 = std::abs((*in1)[x].raw_col_max - (*in1)[y].raw_col_max); int diff4 = std::abs((*in1)[x].max - (*in1)[y].max); int diff5 = std::abs((*in1)[x].raw_col_min - (*in1)[y].raw_col_max); int diff6 = std::abs((*in1)[x].min - (*in1)[y].max); int diff7 = std::abs((*in1)[x].raw_col_max - (*in1)[y].raw_col_min); int diff8 = std::abs((*in1)[x].max - (*in1)[y].min);
and
TWO :
int diff1 = std::abs((*in1)[x].raw_col_min - (*in1)[y].raw_col_min); int diff2 = std::abs((*in1)[x].min - (*in1)[y].min); int diff3 = std::abs((*in1)[x].raw_col_max - (*in1)[y].raw_col_max); int diff4 = std::abs((*in1)[x].max - (*in1)[y].max);
FOUR:
int diff1 = std::abs((*in1)[x].raw_col_min - (*in1)[y].raw_col_min); int diff2 = std::abs((*in1)[x].min - (*in1)[y].min);
and how to do
if ( (diff1 < 9 && diff2 < 9 && diff3 < 9 && diff4 < 9) || (diff5 < 5 && diff6 < 5 && diff7 < 5 && diff8 < 5) ){
if ( (diff1 < 9 && diff2 < 9 && diff3 < 9 && diff4 < 9) ){
if ( (diff1 < 9 || diff2 < 9) && (diff3 < 9 || diff4 < 9) ){
i think that would be enough. Than i should be able to find my way. Or i will come back to you. ;))
Thanks a lot in advence.
PS: i work with médiatek 9200+ and Mali-G715-Immortalis MC11 r1p2
i would resume it by, the number of instructions multipled by the number of data to process.
So, the problem of heating is the bootleneck for mobile and laptop but also for desktop.
I do not know if it is feasible. But space between chip layer to drive heat outside should be possible. this would make the chip a little thicker but cooling system make it also thicker. It is just an idea. May be not the best one. ;))