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FinFET production and the ARM Ecosystem: TSMC readies 16nm FinFET ramp and tips 10nm FinFET plans

Laurence Bryant
Laurence Bryant
January 23, 2014
1 minute read time.

Now that CES is done for another year, it is worth remembering that the diversity of solutions on display and the proliferation of new device experiences at ever lower costs is due to semiconductor vendors being able to leverage the enormous investments that the manufacturing vendors make to continuously improve transistor density and performance at ever smaller process nodes.

TSMC's ability to continue the scaling at the same pace as Intel had been called into doubt late last year by Intel, who also estimated it had a 3.5-year lead in manufacturing. Last week Dr Mark Liu of TSMC decided to put the record straight during an investor event. Mr. Liu explain that today TSMC is manufacturing with 20SoC process, claimed as the highest density process today, and that the next step to 16FinFET would provide further reductions in chip area. (Q4 2013 earnings report  http://www.tsmc.com/english/investorRelations/index.htm)

According to Dr Liu TSMC's 16FinFET process is now product qualified and leverages their grand alliance program of EDA vendors, customers and IP providers. TSMC will be quickly ramping multiple tape outs across industry segments, and already have more than 20 customer tape outs scheduled for 2014. TSMC’s transistor improvements from 20SoC to 16FinFET can reduce the area by 15% giving continued area scaling as opposed to the FUD from Intel that TSMC's scaling stalls at the transition point. SemiWiki - TSMC Responds to Intel's 14nm Density Claim

What I find most interesting is the broad range of applications TSMC’s horizontal business model supports. It seems that TSMC's customers are about to utilize 16FinFET not just in mobile baseband solutions, mobile application processor, but also graphics, networking FPGAs and servers being listed amongst the markets being addressed

It does not stop there, Dr Liu went on to further announce that 10nmFinFET will be ready before the end of 2015, ensuring that TSMC is operating at the leading edge of manufacturing processes and the benefit will be readily felt across the multitude of markets where TSMC's customers operate. This news fits with the need to provide choice across multiple markets at  a variety of nodes to address the needs and desires of 7 billion people. Innovation isn’t going to stop, and ARM’s foundry partners are showing they can continue to provide the breadth of technology solutions to address diverse markets.

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  • Andy Frame
    Andy Frame over 11 years ago

    Thanks for the update Laurence. Adding an ARM Processors mention so the followers of that group get to see your message.

    Andy

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  • Andy Frame
    Andy Frame over 11 years ago

    Thanks for the update Laurence. Adding an ARM Processors mention so the followers of that group get to see your message.

    Andy

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