• Arm Musca-B1 test chip leads the way to develop secure IoT chip designs faster

    Mike EFTIMAKIS
    Mike EFTIMAKIS

    You may already know the Arm Musca-A, the first Platform Security Architecture (PSA) development platform with an Arm Cortex-M33 based subsystem, Arm TrustZone and reference architecture for Arm TrustZone-based systems. The board is a great tool to evaluate…

    • over 1 year ago
    • Internet of Things
    • Internet of Things
  • Arm Delivers a Comprehensive Physical IP Platform for Optimized SoCs with TSMC 22nm ULP/ULL Process Technology

    Geetha Rangarajan
    Geetha Rangarajan

    During the 2018 TSMC Technology Symposium USA event, Arm’s Physical Design Group introduced its development plans for the Artisan physical IP portfolio on TSMC’s 22nm ultra-low power (ULP) and ultra-low leakage (ULL) process platforms. With an aggressive…

    • over 1 year ago
    • System
    • SoC Design blog
  • Open standards: Enabling high performance infrastructure systems with CCIX

    Jim Wallace
    Jim Wallace

    Authors: Kevin Yee, Cadence, and Jim Wallace, Arm

    Unless you’re a hermit or have been living off the grid for the last few years, you can’t help but know about the explosion in big data – the increase in data size and networking bandwidth due to video…

    • over 2 years ago
    • Processors
    • Processors blog
  • PC meets Arm: Integrating PCIExpress into the Arm Server Architecture

    Nick
    Nick

    Earlier this month you may have noticed some press coverage regarding a collaboration between Xilinx, Arm, Cadence and TSMC to deliver 7nm test chip. 

    There are some significant challenges assembling server SoCs for the infrastructure market with the latest…

    • over 2 years ago
    • System
    • SoC Design blog
  • TSMC NA OIP Ecosystem Forum

    Ryan Thomas
    Ryan Thomas
    September 15, 2017 09:00 AM to 07:30 PM Coordinated Universal Time
    5001 Great America Pkwy, Santa Clara, CA 95054, USA
    The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event...
    • over 2 years ago
    • Arm Community
    • Calendar
  • Pushing the limits of tomorrow’s technology today: Artisan physical IP for 7nm

    Ron Moore
    Ron Moore

    ARM Physical IP for TSMC 7nm process technology now available

    Gone are the days when FPGAs were used primarily for prototyping. Today, developers can drive quickly and cost-effectively into IoT, embedded vision, cloud computing and other sectors using…

    • over 3 years ago
    • Processors
    • Processors blog
  • [新闻]针对高性能计算7纳米 FinFET工艺 ARM与台积电签订长期战略合作协议

    Song Bin 宋斌
    Song Bin 宋斌
    Wechat Promotion_900_500-01.jpg

    2016年3月16日,北京讯——ARM和台积电宣布签订针对7纳米 FinFET工艺技术的长期战略合作协议,涵盖了未来低功耗,高性能计算SoC的设计方案。该合作协议进一步扩展了双方的长期合作关系,并将领先的工艺技术从移动手机延伸至下一代网络和数据中心。此外,该协议还拓展了此前基于ARM® Artisan® 基础物理IP 的16纳米 和10纳米 FinFET工艺技术合作。

    ARM全球执行副总裁兼产品事业群总裁 Pete Hutton表示:“现有基于…

    • over 4 years ago
    • 中文社区
    • 中文社区博客
  • ARM’s 64-bit big.LITTLE at 2.5GHz+?  Yes, please with TSMC’s 16nm FinFET Plus!

    Lluis Paris
    Lluis Paris

    The annual Design Automation Conference (DAC) was held last month, and what a show it was!  If you recall, back in February, I talked about TSMC and ARM’s first tape-out with the ARM Cortex-A57 and Cortex-A53 processors. At DAC, we presented…

    • over 5 years ago
    • System
    • SoC Design blog
  • 台积电、三星FinFET各拥新欢 海思实力上浮抢下台积电16nm Fin FET解决方案

    hwdd6873
    hwdd6873

    转自:中国半导体行业协会

    http://www.csia.net.cn/Article/ShowInfo.asp?InfoID=43493


             台湾媒体报道,  台积电大客户高通(Qualcomm)传出首颗Fin FET制程手机芯片,可能先下单给三星电子( SamsungElectronics)后,传出在台积电内部,华为成为第一家量产Fin FET制程的手机芯片客户,出现台积电和三星在下世代Fin FET制程技术上,更拥新欢的有趣现象,半导体产业上、下游竞争同样激烈。…

    • over 5 years ago
    • 中文社区
    • 中文社区博客
  • 台积10nm明年试产,未来5年半导体年增仅3~5%

    wangyong
    wangyong

    年报抢先看
    【萧文康╱台北报导】将在6月24日召开股东会的台积电(2330),股东会年报已先出炉,预估未来5年全球半导体市场年成长率仅3~ 5%,台积电的成长将显著超越全球半导体市场;而在高阶制程进展上,台积电也明确提到10奈米制程将于明年试产、2016年量产。

    在致股东报告书中,台积电董事长张忠谋指出,相较半导体产业表现,台积电自成立27年以来,其中25年业绩成长皆显著高于整体半导体产业水准。
    内容指出,2013年是台积电营收及获利再创高峰的1年。4年前,台积电洞察半导体产业将因智慧型手机与平板电脑等行动运算装置的问市…

    • over 6 years ago
    • 中文社区
    • 中文社区博客
  • First tape-out with TSMC’s 16nm FinFET and ARM’s 64-bit big.LITTLE Processors

    Lluis Paris
    Lluis Paris

    Another important milestone was reached recently for TSMC  and ARM when the teams taped out at the end of December 2013 (see block diagram) the first 64 bit ARMv8 processors in a big.LITTLE configuration on TSMC’s leading edge manufacturing process…

    • over 6 years ago
    • System
    • SoC Design blog
  • FinFET production and the ARM Ecosystem: TSMC readies 16nm FinFET ramp and tips 10nm FinFET plans

    Laurence Bryant
    Laurence Bryant

    Now that CES is done for another year, it is worth remembering that the diversity of solutions on display and the proliferation of new device experiences at ever lower costs is due to semiconductor vendors being able to leverage the enormous investments…

    • over 6 years ago
    • System
    • SoC Design blog