Rising stars: How does Arm lead innovative startups to create new AI advantages

Highlights

On the afternoon of November 28, 2017, the Arm AI Ecosystem Consortium (AIEC) 2017 Shanghai INESA Conference began at the Huaxin Huixiang Center. The conference was built around the theme of "Building dreams together". More than 70 member companies and more than 150 senior managers from the Arm AI Ecosystem Consortium and Shanghai INESA Group attended the event.

Arm AI Ecosystem Consortium (AIEC) 2017 Shanghai INESA Conference

The conference began with a speech from Mr. Allen Wu, EVP and President Arm Greater China. Mr. Wu presented an analysis of the current status of AI interconnections and the importance of open ecosystems to the AI revolution. He also spoke on the outlook and opportunities in the trillion-dollar AI chip market.

Mr Allen Wu, EVP and President Arm Greater China talking at the event

Mr. Jiang Songtao, Vice President of INESA Group, also gave a welcome speech. Mr. Jiang delivered an overview of the industries in which INESA operated and its network. He shared INESA's smart city development plans and the criteria in their selection of smart city partners.

Mr. Jiang Songtao, Vice President of INESA Group giving welcoming speech

AIEC participants offered a rich variety of professional guidelines for recommended AI solutions. ChipIntelli, Beijing TwirlingVR, SenseTime, Kuman Network Technology, NextVPU, OPEN AI LAB, and many other leading companies shared their latest AI technologies and resources as well as pain points in the industry. We would like to see more collaboration across all partners in the ecosystem in a mutually beneficial manner so that the participants may optimize their access to better projects and resources, and thereby effectively accelerating the establishment of the AI industry.

Gao Junxiao, President of ChipIntelli from Chengdu, gave an introduction to smart voice chips and solutions aimed to eliminate existing pain points.

Gao Junxiao, President of ChipIntelli from Chengdu

Yu Jun, Senior Business Manager of Beijing TwirlingVR Technology, presented AI system solutions for different application scenarios.

Yu Jun, Senior Business Manager of Beijing TwirlingVR Technology

Ding Yi, Director of SenseTime East China, introduced SenseTime's leading deep learning identification technology and the latest market trends.

Ding Yi, Director of SenseTime East China

Liang Quan, co-founder of Kuman Network Technology, shared with the audience the latest developments in smart speakers and Kuman's interesting products.

Liang Quan, co-founder of Kuman Network Technology

Yang Xin, Sales Manager of NextVPU, shared with the audience the value of NextVPU products in the AI era.

Yang Xin, Sales Manager of NextVPU

Huang Mingfei, CTO of OPEN AI LAB, dedicated to building embedded AI computing ecosystems, presented OPEN AI LAB's latest technological advances.

Huang Mingfei, CTO of OPEN AI LAB

A variety of on-site activities

Exhibitors and attendees at Arm AI Ecosystem Consortium 2017 Shanghai

We thank INESA Group again for its great support. We thank all AIEC members for attending and supporting the event, which is exactly what it takes to empower AI, accelerate innovation, and establish the industry. See you all at the next stop, Haier Qingdao!

Haier business units and AIEC smart appliances project information session

Time Topic Guest(s)
9:00-10:00 Venue arrangements and demo testing AIEC participants
10:00-11:30 Visit to Haier Cultural Exhibit and Life Exhibit AIEC participants
11:30-12:30 Lunch AIEC participants
13:00-13:10 The announcement of Haier AI application scenario requirements Chief engineer of Haier Advanced R&D Center Dr. Yu Guoxin
13:10-13:25 SenseTime AI strategies and solutions SenseTime
13:25-13:40 Face recognition smart chip AI for everyone
13:40-13:55 Kneron company profile and appliance solutions Kneron
13:55-14:10 Allwinner smart ecosystem Allwinner Technology
14:10-14:25 Kepler camera and "Jiaxing"chip NextVPU
14:25-14:40 Smart platform in Project GD32-MCU GigaDevice
14:40-14:50 Coffee Break  
14:50-15:05 ROOBO AI solutions Roboo
15:05-15:20 Smart acoustics TwirlingVR
15:20-15:35 Low power consumption smart acoustics platforms Bestechnic
15:35-15:50 DNN smart voice chip ChipIntelli
15:50-16:05 Watrix Technology identification technology Watrix Technology
16:05-16:20 AI smart lab and AI collaboration services Open AI Lab
16:20-18:00 Smart appliances project information session Free exchange Haier business units AIEC participants
18:00-18:30 Shuttle bus to hotel AIEC participants
18:30-20:00 Dinner AIEC participants

Date: November 29 - 30

Venue: Go Procurement Training Room on 3F., Building P, Haier Industry Park, No.1 Haier Road, Laoshan District, Qingdao City, Shandong Province, China

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